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DA - IDC / Wire to Board

Wire to Board /  DA - Schema

Profil de produit

ApplicationIDC
ConnectorWire to Board
TechnologyInsulation displacement
Pitch2.0 mm
Smtno

Spécifications

Applicable pc board thickness1.2 to 1.6 mm
Insulation resistance1000 MOhms min.
Temperature range-25 to + 85 Celsius degrees
Voltage rating100V AC, DC
Compliant with rohs

Twin U-slot ID section
The board insertion section of the contact is resilient to ensure easy and secure insertion onto PC boards.
The DA connector is interchangeable with the SAN crimp style board-in connector in terms of insertion hole sizeand pitch.

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