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FE - FFC/FPC / Wire to Board / For FFC/FPC

Wire to Board /  FE - Schema

Product profile

ApplicationFFC/FPC
ConnectorWire to Board
FamilytypeFor FFC/FPC
TechnologyNON-ZIF
Pitch1.25 mm
Smtno

Spécifications

Applicable pc board thickness1.2 to 1.6 mm
Current rating1A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25 to + 85 Celsius degrees
Voltage rating200V AC, DC
Compliant with rohs


Low insertion force and high contact pressure
The FFC is s
Low insertion force and high contact pressure
The FFC is securely connected by simply inserting their leads into the connector.
The contact's solder dip section has a retention mechanism.

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